Technology Solutions

Technology & Equipment Spotlights: Makino HQSF™

This technology is expected to find application in many areas, including the machining of ribs and other hard-to-polish shapes, such as speaker grilles.

The High-Quality Surface Finish (HQSF™) additive technology from Makino improves finishes using copper, high-grade graphite (Poco-3, AFS), and medium-grade graphite (Poco-2, Poco200) on such Ram EDM machines as the EDNC43S. Makino HQSF technology in many cases can eliminate the need for additional benchwork, driving out operational costs.

Makino’s HQSF uses an environmentally safe powder additive that is mixed with the dielectric fluid to improve electrical conductivity for more consistent discharging. This eliminates secondary discharges that waste energy and allow increased efficiency of the sparks, to achieve a superior finish without a loss in metal removal rates.

The additive-based technology has a major impact on finishing time, with a 40 to 50 percent or better improvement of achievable surface finish over conventional EDM sinkers in similar applications. It is available for all Makino Edge and EDNC S-Series EDM machines.

HQSF is a remarkably practical method of machining that combines micro-discharge pulse control, high response servo technology and Makino’s patented additive to improve machine throughput. Makino’s HQSF provides numerous benefits over previous used silicon or chrome additives. This technology is expected to find application in many areas, including the machining of ribs and other hard-to-polish shapes, such as speaker grilles.

Superior, more uniform surface finishes, having a shallow Heat Affected Zone (HAZ), are achieved. Finishing speeds are markedly faster than conventional EDM and stability of the machining process is enhanced.

Equalized distribution in the dielectric fluid is accomplished easily due to the low specific gravity of the micro SC additives. This results in superior sidewalls as well as bottom surface finishes. Unlike other additives, flushing is not necessary to sustain even additive distribution on sidewall areas. Another major improvement to this technology is the elimination of a dual dielectric system. A single dielectric system consumes less space and requires less overall maintenance than a dual dielectric system. In addition, micro SC costs less to use than other additives.